Smart devices are already communicating with each other. That will do more than 15 billion in 2015. But it was not just about global trends. Much more interesting for the participants was the question “What comes next?”. Under this heading, the third Intel Core generation was presented, which will complement the existing technologies February 2019 Calendar South Africa with Shark Bay next year. Concretely, the platforms Sandy- and Ivy-Brigde will be complemented with existing or planned products in the foreseeable future.
February 2019 Calendar South Africa
Munich Customer Seminar: Comp-Mall and IEI TechnologyMünchner Customer Seminar: Comp-Mall and IEI Technology (Comp-Mall ) In this context, the question of the use of mobile CPUs in the projects was discussed in connection with the Sandy Bridge platform. Since the TDP for desktop and mobile CPU variants is at 35 W, core count and cache is the same for almost all models in the embedded roadmap, it is the end user who decides in addition to the price as the strongest differentiator.
For critical ambient temperatures the mobile CPUs still have the processors that meet these requirements. As a product example, the Mini-ITX model KINO-AH611 could be called, which will be available in the fall of this year. It supports the second generation Core i7 / i5 / i3 CPUs, DDR3 SO-DIMM up to 16 GB, DVI / VGA / HDMI, SATA 3 Gb / s, includes ten COM ports, a PCI extension and is with AT- or ATX power function switchable.
More than 20 Sandy Bridge products will be available by the end of this year. Embedded Display Port (eDP) as the successor to LVDSMore board-level discussion topics included critical review of value for money, the H61 chipset, and the Presentation of the third Intel Atom CPU generation. In this context, the Cedar Trail platform was presented.
In addition to the upgrade to HDMI 1.3a, a new interface will be found on the products: the eDP. The Future: Upcoming Boundary-Scan StandardsDifferent IEEE working groups are currently developing the Boundary Scan technology. Ultimately, the work of these groups will result in official standards that will eventually be available to the chip, assembly and system vendors.
The revision is mainly concerned with the module interfaces at the board level and includes the following ideas: a standardized initialization procedure for complex I / O pins (eg multiple voltages in a single module, sleep mode, etc.) to extend the tests, better Support for differential drivers and sensors, use of non-connected pins of a device or better support of power and GND connections.
The following developments are currently underway: IEEE P1149.1-2012: A design template for upgrading the 1149.1, which will be compatible with the current standard.Furthermore, the use of the TRST pin is defined – since there were numerous debates since the 1990 standard release. IEEE P1149.8.In addition to the usability of the economical February 2019 Calendar South Africa and yet powerful N2600 CPU with only 3.5 W, the DirectX10 and OpenGL3.0 support and a resolution of up to 2560×1600 are particularly outstanding Pixels (on eDP).